SAI Laser M E R C U R Y
The “top of the range” professional laser system for CO2 laser cutting and marking
- Processes: cutting, kiss-cutting and marking, engraving and micro-perforation.
- Processable materials: PMMA, acetates, ABS, plastics in general, micanite, wood, hide, paper and cardboard, textiles, marking on glass and marble (excluding PVC and polycarbonate), thin ferrous and not ferrous metals.
- Sectors: small items and furnishing accessories (customisation), decoration and inlay, stamps, display cases, footwear, leather, processing of sheet and/or roll materials, lighting, electronics, backlight, automotive, eyewear, flags and banners, signage, sportswear.
- Advanced, innovative technology.
- Great flexibility of use and application/processing.
- High performance.
- Cartesian X-Y axes with linear motors.
- Position control thanks to linear optical encoders.
- Working area:1250x1550mm – 1500x2050mm – 1500x3080mm – 2060x3080mm – 2500x3080mm 3200x1500mm.
- CCD camera and kit for register cutting with print marker recognition.
- 3D kit for cutting and kiss-cutting of materials with surface with 3D rotation.
- 360° rotary axis unit for engraving and/or cutting on cylindrical items.
- ICARO proprietary software.
- Industry 4.0 Ready: full digital workflow integration.
- Accessibility.
- Accuracy and repeatability.
- High performance.
- Easy to use.
- Zero maintenance.
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Configurations:
- Fixed work table.
- Double table for loading and unloading.
- Conveyor for roll materials processing.
- Double drawers.